TMC-705 performs well in high purity metalizing applications where quick pump-down is needed, as well as thermal, radiation and chemical stability.

Because of its low vapor pressure, TMC-705 can reduce the chances for contamination in untrapped systems by a factor of 100 or more compared to TMC-704 and other fluids. The vapor pressure is so low, that deepest vacuum levels can be obtained with water cooled baffles alone.